Shenzhen Chipskey Technology CO.,LTD.5180000About Us16H Block A,Duhui 100 Building,Huaqiangbei, Futian, Shenzhen, Guangdong, China 518031We mainly at Raspberry PI series accessories, Board&shield for arduino, Sensor module For Arduino, Smart Car Robot, Smart DOF Robot, DIY toys, Educational toys, and 3D printer series We also professional at IC , Capacitor , Resistor , Inductor and diode troide series electronic components!Shenzhen Chipskey Technology CO.,LTD.5180000About Us16H Block A,Duhui 100 Building,Huaqiangbei, Futian, Shenzhen, Guangdong, China 518031We mainly at Raspberry PI series accessories, Board&shield for arduino, Sensor module For Arduino, Smart Car Robot, Smart DOF Robot, DIY toys, Educational toys, and 3D printer series We also professional at IC , Capacitor , Resistor , Inductor and diode troide series electronic components!Shenzhen Chipskey Technology CO.,LTD.Shenzhen Chipskey Technology CO.,LTD.Shenzhen Chipskey Technology CO.,LTD.Shenzhen Chipskey Technology CO.,LTD.Shenzhen Chipskey Technology CO.,LTD.Shenzhen Chipskey Technology CO.,LTD.Shenzhen Chipskey Technology CO.,LTD.Shenzhen Chipskey Technology CO.,LTD.Shenzhen Chipskey Te

GY-88 MPU-6050 HMC5883L BMP085 10DOF Flight Sensor
GY-88 MPU-6050 HMC5883L BMP085 10DOF Flight Sensor

GY-88 MPU-6050 HMC5883L BMP085 10DOF Flight Sensor

Model NO.
10A025
Minimum order quantity
1 piece
Country of Origin
HK/Shenzhen
Quantity:
  • Model Number:10A025
  • Type:Sensor Development Boards and Kits, Drive IC
  • Place of Origin:China
  • Brand:MIC
  • Category:Module
  • Lead Free Status:Lead free / RoHS Compliant
  • Condition:Brand New With Original Manufacturer
  • Packaging:Reel Tray Tube
  • Warranty:360days
  • Operating Temperature:-40C ~ 125C
  • Dissipation Power:1W-6W
  • Application:Watch

HMC5883L BMP085 MWC four-axis flight control sensor accessories; electronic compass atmospheric pressure

Number: M114

HMC5883L BMP085 MWC four axis flight control sensor accessories electronic compass pressure module

A large number of goods, the original chips. Module using immersion gold process.

Module using microarray: HMC5883L BMP085

Module size: 18mm multiplied by 14mm

Communication: IIC, 3-5V compatibility level

Power supply: 5V

Delivery header without welding. Be careful

Provide test code, schematics, related data manual.

Module interface is as follows: the front face of the module diagram

 

 

 

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